The description of epoxy resin board

Epoxy resin board is also known as epoxy glass fiber board. The molecular structure contains active epoxy groups, so that they can cross-link with various types of curing agents to form an insoluble, infusible, high-temperature three-dimensional network structure.

Epoxy resin board is also known as epoxy glass fiber board, epoxy phenolic laminated glass cloth board, epoxy resin refers to organic polymer compounds containing two or more epoxy groups in the molecule, except for individual. The relative molecular mass is not high. The molecular structure of epoxy resins is characterized by the presence of active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or in a ring structure of the molecular chain. Because the molecular structure contains active epoxy groups, they can crosslink with various types of curing agents to form insoluble and infusible polymers with a three-dimensional network structure. The glass fiber cloth is made of epoxy resin bonded by heating and pressurizing. It has high mechanical properties at medium temperature and stable electrical properties at high humidity. Epoxy resin board is suitable for high-insulation structural parts for machinery, electrical appliances and electronics. It has high mechanical and dielectric properties and good heat resistance and moisture resistance. Heat resistance level F (155 degrees). Specification thickness: 0.5 ～ 100mm deformed by heating under the condition of high temperature 180 ℃ which generally not heated together with other metals that may cause deformation of the metal plate.

The strong adhesion of epoxy resin board

The existence of polar hydroxyl and ether bonds inherent in the epoxy resin molecular chain makes it highly adhesive to various substances. Epoxy resins have low shrinkage when cured, and the generated internal stress is small, which also helps to improve the adhesion strength.

Strong contraction of epoxy resin board

The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

Mechanical properties of epoxy resin board

The cured epoxy resin system has excellent mechanical properties.

Electrical performance of epoxy resin board

The cured epoxy resin system is an excellent insulating material with high dielectric properties resistance to surface leakage, and arc resistance.

Chemical stability of epoxy resin board

Generally, the cured epoxy resin system has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of cured epoxy systems, chemical stability also depends on the resin and curing agent chosen. Proper selection of epoxy resin and curing agent can make it that have special chemical stability.