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FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with copper foil on one side or both sides, and CCL is finally formed by hot pressing and curing.
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
Transfer: Use clean gloves in the process of handling to prevent contamination and oxidation of the copper clad laminate.
Package&Storage: Sealed packaging with plastic cloth. Avoid direct sunlight, rain, high temperature, humidity, and bending. Keep it at room temperature and the relative humidity of 70%. The storage period is 12 months.
Specification
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
Technical Data
Note: The data in the above table only represents typical or average data, just for reference in practical application. It does not bear any responsibility for the use of the product or related legal liability.| FR-4 | CEM-3 | |||
| Test item | Unit | Test condition | Specification(IPC-4101C) | |
| Peel Strength | N/mm | 125℃ | ≥0.7 | AABUS |
| Float 288℃/10sec | ≥1.05 | AABUS | ||
| Thermal Stress | sec | float 288℃/unetched | ≥10 | ≥10 |
| Bow/twist | ％ | A | ≤1.0 | ≤1.0 |
| Flexural strength | N/mm² | Warp | ≥415 | ≥276 |
| Rating | Fill | ≥345 | ≥186 | |
| Flammability | ℃ | UL94 | UL94V-0 | UL94V-0 |
| Glass transiting(Tg) | MΩ | E-2/105(DSC) | ≥130 | ≥130 |
| Surface resistivity | MΩ-cm | C-96/35/90 | ≥1.0*104 | ≥1.0*104 |
| Volume resistivity | MΩ/cm | C-96/35/90 | ≥1.0*106 | ≥1.0*106 |
| Dielectric constant | - | Etched/@1MHz | ≤5.4 | ≤5.4 |
| Loss tangent | sec | Etched/@1MHz | ≤0.035 | ≤0.035 |
| Arc resistance | % | D-48/50+D-0.5/23 | ≥60 | ≥60 |
| Moisture absorption | % | D-24/23 | ≤0.35(min 0.51mm) | ≤0.5 |
| E-2/105TMA | ≤0.80(max 0.51mm) | |||
| Comparative tracking index | V | Etched/0.1%HN4CL | ≥150 | ≥175 |
Transfer: Use clean gloves in the process of handling to prevent contamination and oxidation of the copper clad laminate.
Package&Storage: Sealed packaging with plastic cloth. Avoid direct sunlight, rain, high temperature, humidity, and bending. Keep it at room temperature and the relative humidity of 70%. The storage period is 12 months.
Specification
| Base Color | Thickness | Copper Foil Thickness | Regular Size |
| Yellow / Nature /gold | 0.05～3.5mm | 12/18/35/70/105 um | 915*1220mm(36*48) 1020*1220mm(40*48) 1040*1240mm(41*49) |
| 1/2oz / 1oz/ 2oz/ 3oz |
