Application characteristics of insulation fiber board epoxy resin board

Application characteristics of insulation fiber board epoxy resin board

1. Various forms. A variety of resins, curing agents, and modifier systems can be adapted to almost any type of application, ranging from low viscosity to high melting point solids.

2. Easy to cure. With various curing agents, the epoxy resin system can be cured in the temperature range of 0 ~ 180℃.

3. Strong adhesion. The existence of intrinsic hydroxyl and ether bonds in epoxy laminates makes them have high adhesion to various substances. Epoxy resin has low shrinkage and low internal stress during curing, which is also helpful to improve adhesion strength.

4. Low contractility. The epoxy resin reacts with the curing agent used by direct addition or ring-opening polymerization of the epoxy group in the resin molecules without water or other volatile by-products being released. They exhibit very low shrinkage (less than 2%) during curing compared with unsaturated polyester and phenolic resins.

5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.